A 450-millimeter (mm)-diameter silicon wafer is the next wafer-size transition for semiconductor manufacturing. 450-mm wafers provide 2.25 times the area of a 300-mm wafer and thus increase the number of devices that can be processed at one time. Depending on the device die size, up to 2.5 times more devices can be placed on a 450-mm wafer than on a 300-mm wafer.